Fabrication and tribological behavior of sputtering TaN coatings

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Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

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Comparison of the diffusion barrier properties of chemical-vapor-deposited TaN and sputtered TaN between Cu and Si

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Natural Sciences, Materials Engineering, Materials Science +17

Biomedical properties of tantalum nitride films synthesized by reactive magnetron sputtering

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Phase composition and microstructure of polycrystalline and epitaxial TaNx layers grown on oxidized Si(001) and MgO(001) by reactive magnetron sputter deposition

Cheung Soo Shin, Y.-W. Kim, Daniel Gall et al. · Thin Solid Films · 2002 · 117 citations

Natural Sciences, Materials Engineering, Materials Science +17