Micromachined end-effector and techniques for directed MEMS assembly

Abstract

A micromachined end-effector along with techniques in micromanipulation for directed micro-electro-mechanical systems (MEMS) assembly is presented. A passive end-effector, fabricated in a 50 µm thick single crystal silicon (SCS) deep reactive ion etched (DRIE) process, is compared with a microgripper made with the same process. With this passive tool, pick and place assembly of MEMS components can be accomplished reliably, since the end-effector is more mechanically robust than comparable microgrippers. This end-effector can withstand an order of magnitude more force than conventional MEMS based microgrippers used for microassembly. In addition, the elimination of any actuation reduces packaging complexity and allows easier integration of sensing mechanisms for feedback control. This simplified passive end-effector with an integrated electrical contact sensor is also presented, along with assembly techniques and designs used for directed pick and place MEMS assembly. Both mechanical and electrical MEMS interconnects are demonstrated.