Reliability of lead-free solder joints in CSP device under thermal cycling

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

A.A. El-Daly, A.E. Hammad · Materials & Design (1980-2015) · 2012 · 136 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effects of rare earths on properties and microstructures of lead-free solder alloys

Liang Zhang, Songbai Xue, Lili Gao et al. · Journal of Materials Science Materials in Electronics · 2009 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +12

Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach

Kenny C. Otiaba, Raj Bhatti, N.N. Ekere et al. · Engineering Failure Analysis · 2012 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +16

Thermal fatigue analysis of a CBGA package with lead-free solder fillets

Bo Hong · 2002 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +17

Finite element analysis for solder ball failures in chip scale package

Taekoo Lee, Jinhyuk Lee, Ilgyu Jung · Microelectronics Reliability · 1998 · 44 citations

Engineering, Materials Engineering, Materials Science +15