Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities

Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces

A. F. Mayadas, M. Shatzkes · Physical review. B, Solid state · 1970 · 2.2K citations

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Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

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Electrodeposition of Copper in the SPS-PEG-Cl Additive System

Thomas P. Moffat, Daniel Wheeler, D. Josell · Journal of The Electrochemical Society · 2004 · 356 citations

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Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements

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