Concepedia

Prediction of mechanical stresses induced by flip-chip underfill encapsulants during cure

Marcel Meuwissen, H.A. de Boer, H.L.A.H. Steijvers, K.M.B. Jansen, P.J.G. Schreurs, M.G.D. Geers

International Journal of Adhesion and Adhesives · 2005 · 15 citations · 18 references

DOI

Concepts

References

18

Prediction of the glass transition temperature of polymers: A model based on the principle of corresponding states

A. T. Dibenedetto · Journal of Polymer Science Part B Polymer Physics · 1987 · 395 citations

, , +17

Chemorheology of thermosets—an overview

Peter J. Halley, Michael E. Mackay · Polymer Engineering and Science · 1996 · 346 citations

, , +15

Process Modeling of Composite Materials: Residual Stress Development during Cure. Part I. Model Formulation

Scott R. White, H. Thomas Hahn · Journal of Composite Materials · 1992 · 342 citations

, , +17

Time-cure superposition during crosslinking

Douglas Adolf, James E. Martin · Macromolecules · 1990 · 246 citations

, , +7

Stress relaxation behavior of 3501‐6 epoxy resin during cure

Yeong K. Kim, Scott R. White · Polymer Engineering and Science · 1996 · 237 citations

, , +17