IEEE Electron Device Letters · 2015 · 40 citations · 26 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsChemical Vapor DepositionDopingRare-earth-doped MaterialsSemiconductor Device MaterialsSemiconductor InterfacesSilicon MaterialsDoping Effects On Device PerformanceIn-situ DopingPhosphorus IncorporationResistivitySemiconductor DopingSemiconductor Doping ProfilesSilicon Chemical Vapor DepositionSilicon Doping
The phosphorus incorporation by chemical vapor deposition and activation by laser annealing reaches the electron concentration of ~3 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">20</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> . The pulsed laser not only activates the phosphorus but also produces the biaxial tensile strain of 0.35%. With the nickel germanide contact, the specific contact resistivity reaches as low as 1.5 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-8</sup> Ω-cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> by greatly reducing the tunneling distance. Due to 4% misfit between Ge and Si, there are still misfit dislocations near the Ge/Si interface. The misfit dislocations at the Ge/Si interface lead to the ideality factor of 1.6 for the Ge/Si hetero-junction diode with ON/OFF ratio of ~1 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sup> .
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Germanium n-type shallow junction activation dependences
Chi On Chui, Leonard Kulig, Jean M. Moran et al. · Applied Physics Letters · 2005 · 177 citations