Concepedia
Applied Surface Science · 2015 · 19 citations · 22 references
Natural SciencesMaterials EngineeringMaterials ScienceColloid ScienceNanomaterialsSurface ScienceColloid ChemistrySlurry RheologySurface MorphologySilica-based Materials
22
Effects of particle size, polishing pad and contact pressure in free abrasive polishing
Yongsong Xie, Bharat Bhushan · Wear · 1996 · 231 citations
Engineering, Materials Engineering, Materials Science +16
Chemical effect on the material removal rate in the CMP of silicon wafers
Yongguang Wang, L.C. Zhang, A.Q. Biddut · Wear · 2010 · 150 citations
CMP of hard disk substrate using a colloidal SiO2 slurry: preliminary experimental investigation
Hong Lei, Jianbin Luo · Wear · 2004 · 134 citations
Natural Sciences, Materials Engineering, Materials Science +10
Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes
Hyunseop Lee, Haedo Jeong, David Dornfeld · Precision Engineering · 2013 · 106 citations · Full text
Engineering, Materials Engineering, Materials Science +10
Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces
Hyunseop Lee, Hyun Do Jeong · CIRP Annals · 2009 · 93 citations