Hyunseop Lee - Concepedia

Author

Hyunseop Lee

Also Known As

H.S. Lee, Haneum Lee, Hyun Seop Lee, Hyun-Seop Lee, HyunSeop Lee, Hyunseop LEE, Hyunseop Lee, Lee, Hyun Seop, Lee, Hyun-Seop;Park, Boum-Young;Jeong, Hae-Do;Kim, Hyoung-Jae;, Sukhoon Jeong

152

Publications

Citations

H-Index

Concepts

All Affiliations

Pusan National University Tongmyong University Korea Institute of Industrial Technology University of California, Berkeley Dong-A University

About

Hyunseop Lee is an author at Pusan National University specializing in engineering, mechanical engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	19	38	1.2K
2	Applied Physics	3	3	138
3	Medicine	2	2	41
4	Health Sciences	1	1	29
5	Biomedical Engineering	1	1	14

Hyunseop Lee

Publications

1.3K

Citations

H-Index

Page 1

	Year	Citations
Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes Hyunseop Lee, Haedo Jeong, David Dornfeld Precision Engineering Materials ScienceMaterials EngineeringChemical EngineeringEngineeringMaterial Processing	2013	104
Hybrid polishing mechanism of single crystal SiC using mixed abrasive slurry (MAS) Hyunseop Lee, D.I. Kim, Jingyan An, CIRP Annals Materials EngineeringMaterials ScienceSingle Crystal SicMixed Abrasive SlurryEngineering	2010	94
Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces Hyunseop Lee, Hyun Do Jeong CIRP Annals Materials ScienceMaterials EngineeringSurface CharacterizationEngineeringElectronic Materials	2009	93
A wafer-scale material removal rate profile model for copper chemical mechanical planarization Hyunseop Lee, Haedo Jeong International Journal of Machine Tools and Manufacture Materials ScienceEngineeringMaterial ProcessingIndustrial EngineeringMaterial Machining	2011	82
Mechanical effect of colloidal silica in copper chemical mechanical planarization Hyunseop Lee, Sukbae Joo, Haedo Jeong Journal of Materials Processing Technology Materials ScienceColloidal MaterialEngineeringMechanical PropertiesMechanical Engineering	2009	55
Influence of slurry components on uniformity in copper chemical mechanical planarization Hyunseop Lee, Boumyoung Park, Haedo Jeong Microelectronic Engineering Materials ScienceMaterials EngineeringChemical EngineeringEngineeringSlurry Components	2008	52
A MATLAB method of lines template for transport equations Hyunseop Lee, Craig J. Matthews, R. D. Braddock, Environmental Modelling & Software Numerical AnalysisNumerical ComputationEngineeringNumerical SimulationTransport Phenomena	2003	46
Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry Boumyoung Park, Hyunseop Lee, Kihyun Park, Journal of Materials Processing Technology Materials ScienceEngineeringPad Roughness VariationMechanical EngineeringCeria-based Cmp Slurry	2007	42
Application of electrolytic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard–brittle materials used in light-emitting diodes Hyunseop Lee, Hiroshi Kasuga, Hitoshi Ohmori, Journal of Crystal Growth Materials EngineeringMaterials ScienceEngineeringHard–brittle MaterialsMaterial Processing	2011	37
Effect of pad groove geometry on material removal characteristics in chemical mechanical polishing Yongchang Guo, Hyunseop Lee, Youngkyun Lee, International Journal of Precision Engineering and Manufacturing Materials ScienceChemical EngineeringMaterial Removal CharacteristicsEngineeringMaterial Processing	2012	33

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