Concepedia

Hyunseop Lee

HL

47

Publications

1.3K

Citations

21

H-Index

2002

Active since

Affiliations

Pusan National University(Current)

Tongmyong University

Korea Institute of Industrial Technology

University of California, Berkeley

Dong-A University

Hyunseop Lee is an author at Pusan National University specializing in engineering, mechanical engineering, and materials science.

Top concepts

EngineeringMechanical EngineeringMaterial ScienceMaterial ProcessingChemical EngineeringMaterials EngineeringMicrofabricationSurface PolishingCorrosionMicrostructure

Publications per year

2002–2023

47

Publications

47

Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes

Hyunseop Lee, Haedo Jeong, David Dornfeld · Precision Engineering · 2013 · 104 citations

Materials Science, Materials Engineering, Chemical Engineering +8

Hybrid polishing mechanism of single crystal SiC using mixed abrasive slurry (MAS)

Hyunseop Lee, D.I. Kim, Jingyan An et al. · CIRP Annals · 2010 · 94 citations

Materials Engineering, Materials Science, Single Crystal Sic +9

Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces

Hyunseop Lee, Hyun Do Jeong · CIRP Annals · 2009 · 93 citations

Materials Science, Materials Engineering, Surface Characterization +12

A wafer-scale material removal rate profile model for copper chemical mechanical planarization

Hyunseop Lee, Haedo Jeong · International Journal of Machine Tools and Manufacture · 2011 · 82 citations

Materials Science, Engineering, Material Processing +8

Mechanical effect of colloidal silica in copper chemical mechanical planarization

Hyunseop Lee, Sukbae Joo, Haedo Jeong · Journal of Materials Processing Technology · 2009 · 55 citations

Materials Science, Colloidal Material, Engineering +9

Rows per page

1–5 of 47