Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes - Concepedia

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Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes

104

Citations

31

References

2013

Year

Hyunseop Lee, Haedo Jeong, David Dornfeld

Precision Engineering

Materials ScienceMaterials EngineeringChemical EngineeringEngineeringMaterial ProcessingCorrosionMaterial MachiningMechanical EngineeringMetallurgical ProcessSurface ProcessingAbrasive Process

References

	Year	Citations

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