Haedo Jeong - Concepedia

Author

Haedo Jeong

Also Known As

H. D. Jeong, H. Jeong, H.D Jeong, H.D. Jeong, HAE-DO JEONG, Hae-Do Jeong, Hae-do Jeong, HaeDo Jeong, Haedo JEONG, Haedo Jeong

223

Publications

2.7K

Citations

H-Index

Concepts

All Affiliations

Pusan National University Korea Institute of Industrial Technology University of California, Berkeley Tongmyong University

About

Haedo Jeong is an author at Pusan National University specializing in engineering, mechanical engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	28	64	1.9K
2	Applied Physics	5	5	179
3	Education	2	2	85
4	Natural Sciences	1	1	42
5	Social Sciences	1	1	15

Haedo Jeong

Publications

1.9K

Citations

H-Index

Page 1

	Year	Citations
Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes Hyunseop Lee, Haedo Jeong, David Dornfeld Precision Engineering Materials ScienceMaterials EngineeringChemical EngineeringEngineeringMaterial Processing	2013	104
Effects of pad properties on material removal in chemical mechanical polishing K.H. Park, Hyo Ju Kim, Okkyung chang, Journal of Materials Processing Technology Materials ScienceMaterials EngineeringChemical EngineeringEngineeringMaterial Processing	2007	101
A wafer-scale material removal rate profile model for copper chemical mechanical planarization Hyunseop Lee, Haedo Jeong International Journal of Machine Tools and Manufacture Materials ScienceEngineeringMaterial ProcessingIndustrial EngineeringMaterial Machining	2011	82
Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization Hyoungjae Kim, Haedo Jeong Journal of Electronic Materials Materials ScienceEngineeringWear TestingMicrofabricationTool Wear	2004	61
Mechanical effect of colloidal silica in copper chemical mechanical planarization Hyunseop Lee, Sukbae Joo, Haedo Jeong Journal of Materials Processing Technology Materials ScienceColloidal MaterialEngineeringMechanical PropertiesMechanical Engineering	2009	55
Influence of slurry components on uniformity in copper chemical mechanical planarization Hyunseop Lee, Boumyoung Park, Haedo Jeong Microelectronic Engineering Materials ScienceMaterials EngineeringChemical EngineeringEngineeringSlurry Components	2008	52
The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer Chuljin Park, Hyoungjae Kim, Sangjik Lee, International Journal of Precision Engineering and Manufacturing-Green Technology Materials EngineeringMaterials ScienceEngineeringMaterial ProcessingCorrosion	2015	50
Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw Doyeon Kim, Hyoungjae Kim, Sangjik Lee, International Journal of Precision Engineering and Manufacturing-Green Technology Diamond-like CarbonEngineeringMechanical EngineeringApplied PhysicsDiamond Wire	2015	50
Analysis of removal mechanism on oxide CMP using mixed abrasive slurry Hojun Lee, Haedo Jeong International Journal of Precision Engineering and Manufacturing Materials ScienceSewage Sludge TreatmentChemical EngineeringMixed Abrasive SlurryEngineering	2015	48
Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires Hyoungjae Kim, Doyeon Kim, Chul Min Kim, CIRP Annals Materials ScienceDiamond-like CarbonEngineeringMulti-wire SawingMechanical Engineering	2013	46

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