Concepedia

Haedo Jeong

HJ

67

Publications

1.9K

Citations

28

H-Index

2001

Active since

Affiliations

Pusan National University(Current)

Korea Institute of Industrial Technology

University of California, Berkeley

Tongmyong University

Haedo Jeong is an author at Pusan National University specializing in engineering, mechanical engineering, and materials science.

ORCID

Top concepts

Publications per year

2001–2024

67

Publications

67

Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes

Hyunseop Lee, Haedo Jeong, David Dornfeld · Precision Engineering · 2013 · 104 citations

, , +8

Effects of pad properties on material removal in chemical mechanical polishing

K.H. Park, Hyo Ju Kim, Okkyung chang et al. · Journal of Materials Processing Technology · 2007 · 101 citations

, , +12

A wafer-scale material removal rate profile model for copper chemical mechanical planarization

Hyunseop Lee, Haedo Jeong · International Journal of Machine Tools and Manufacture · 2011 · 82 citations

, , +8

Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization

Hyoungjae Kim, Haedo Jeong · Journal of Electronic Materials · 2004 · 61 citations

, , +10

Mechanical effect of colloidal silica in copper chemical mechanical planarization

Hyunseop Lee, Sukbae Joo, Haedo Jeong · Journal of Materials Processing Technology · 2009 · 55 citations

, , +9

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