A.Q. Biddut

Chemical effect on the material removal rate in the CMP of silicon wafers

Yongguang Wang, L.C. Zhang, A.Q. Biddut · Wear · 2010 · 143 citations

Materials Science, Materials Engineering, Chemical Engineering +12

Dependence of pad performance on its texture in polishing mono-crystalline silicon wafers

L.C. Zhang, A.Q. Biddut, Y.M. Ali · International Journal of Mechanical Sciences · 2009 · 36 citations

Materials Science, Materials Engineering, Wafer Scale Processing +11

Damage-free polishing of monocrystalline silicon wafers without chemical additives

A.Q. Biddut, L.C. Zhang, Y.M. Ali et al. · Scripta Materialia · 2008 · 32 citations

Materials Engineering, Materials Science, Wafer Scale Processing +6

Performance of single crystal diamond tools with different rake angles during micro-grooving on electroless nickel plated die materials

A.Q. Biddut, M. Rahman, K.S. Neo et al. · The International Journal of Advanced Manufacturing Technology · 2006 · 26 citations

Materials Science, Diamond-like Carbon, Different Rake Angles +8