CMP of hard disk substrate using a colloidal SiO2 slurry: preliminary experimental investigation

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Materials Science, Tribological Coating, Engineering +10

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Materials Science, Silicon Wafers, Engineering +7

Effects of particle size, polishing pad and contact pressure in free abrasive polishing

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Materials Science, Engineering, Corrosion +10

Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects

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Engineering, Coarse Particles, Mechanical Engineering +18