Fan-out technologies for WiFi SiP module packaging and electrical performance simulation

Abstract

The purpose of this paper is to study the Wi-Fi SiP (System-in-Package) module manufactured by the Fan-out technology, which includes dual layer RDL. In this Fan-out package, numerous components (including active chip and RLC passive components) are encapsulated by compression molding, and signals are interconnected by RDL. Without substrate (replaced by molding compound), this Fan-out package can be thinner and lower cost. Electrical simulation for RF signal integrity is also studied in this paper, to understand the Fan-out technology's characterization on RF SiP design application. To evaluate the Fan-out technology on module level performance, simulation on RF impedance matching, power integrity and thermal distribution with complete Wi-Fi SiP module is also discussed in this paper.