Power Integrity Analysis

Power Integrity Analysis is a methodological framework within interconnect design that evaluates and ensures the stability, quality, and reliability of power delivery networks by minimizing voltage fluctuations, noise, and electromagnetic interference under dynamic operating conditions.

119

Publications

3.2K

Citations

395

Authors

123

Institutions

Publications per year

2017–2026

Parents

Interconnect Design

Publications

119

Electromagnetic Interference (EMI) of System-on-Package (SOP)

T. Sudô, Hideki Sasaki, Norio Masuda et al. · IEEE Transactions on Advanced Packaging · 2004 · 194 citations

Engineering, Electrical Engineering, Antennas +16

Toward an Open-Source Digital Flow

Tutu Ajayi, Vidya A. Chhabria, Mateus Fogaça et al. · 2019 · 165 citations · Full text

Engineering, Computer Engineering, Computer Science +17

Designing and Modeling for Power Integrity

Madhavan Swaminathan, Daehyun Chung, S. Grivet‐Talocia et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 146 citations · Full text

Engineering, Electrical Engineering, Circuit Theory +15

Power Supply Noise in SoCs: Metrics, Management, and Measurement

K. Arabi, Resve Saleh, Xiongfei Meng · IEEE Design & Test of Computers · 2007 · 113 citations

Engineering, Computer Engineering, Electrical Engineering +16

Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging

Madhavan Swaminathan, Hakki Mert Torun, Huan Yu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 87 citations

Computing, Computer Science, Electrical Engineering +16

1–5 of 119

Authors

395

JF
Jun Fan
Missouri University of Science and Technology, United States
11 publications · 283 citations
11
h-index
MS
Madhavan Swaminathan
Georgia Institute of Technology, United States
11 publications · 413 citations
10
h-index
JL
James L. Drewniak
Missouri University of Science and Technology, United States
7 publications · 304 citations
7
h-index
SK
Sung Kyu Lim
Georgia Institute of Technology, United States
7 publications · 160 citations
7
h-index
AO
Antonio Orlandi
University of L'Aquila, Italy
5 publications · 149 citations
5
h-index

1–5 of 395

Institutions

123

1–8 of 123

Venues

IEEE Transactions on Components Packaging and Manufacturing Technology
11 publications · 296 citations
11
h-index
IEEE Transactions on Electromagnetic Compatibility
10 publications · 374 citations
10
h-index
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
4 publications · 94 citations
4
h-index
IEEE Transactions on Microwave Theory and Techniques
4 publications · 124 citations
4
h-index
IEEE Transactions on Advanced Packaging
4 publications · 262 citations
4
h-index

1–5