1
Publications
77
Citations
1
H-Index
2013
Active since
Affiliations
National Cheng Kung University(Current)
Shang-Shiuan Deng is an author at National Cheng Kung University specializing in refrigeration, microfabrication, and electronic packaging.
Top concepts
3D PrintingEngineeringHeat TransferRefrigerationMaterial ScienceMicroelectronicsMicrofabricationThermal EngineeringElectronic PackagingFlexible Electronics
Publications per year
2013–2013
1
1
Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
Shang-Shiuan Deng, Sheng‐Jye Hwang, Huei‐Huang Lee · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 77 citations
Engineering, Encapsulation Process, Mechanical Engineering +19
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