Concepedia

Wafer-level Release Processes

Wafer-Level Release Processes is a micromachining fabrication strategy that belongs to the class of release techniques in MEMS manufacturing, distinguished by its execution of structural liberation of microdevices at the entire wafer scale prior to dicing, thereby enabling batch-level processing and enhanced device uniformity.

17

Publications

470

Citations

62

Authors

33

Institutions

Publications per year

2017–2026

0

Parents

Publications

17

Silicon micro XY-stage with a large area shuttle and no-etching holes for SPM-based data storage

Che-Heung Kim, Hee-Moon Jeong, Jong-Up Jeon et al. · Journal of Microelectromechanical Systems · 2003 · 75 citations

, , +15

CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration

Bing Dang, Paul Andry, Cornelia Tsang et al. · 2010 · 46 citations

, , +17

A clean wafer-scale chip-release process without dicing based on vapor phase etching

Thomas Overstolz, P.-A. Clerc, Wilfried Noell et al. · 2004 · 43 citations

, , +16

The Black Silicon Method V: A Study Of The Fabricating Of Movable Structures For Micro Electromechanical Systems

M. de Boer, Henri Jansen · Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95 · 2005 · 40 citations · Full text

, , +17

Polymolding: Two Wafer Polysilicon Micromolding of Closed-Flow Passages for Microneedles and Microfluidic Devices

Neil H. Talbot · 1998 Solid-State, Actuators, and Microsystems Workshop Technical Digest · 1998 · 36 citations · Full text

, , +17

1–5 of 17

Authors

62

  1. MW
    Michael Ward

    University of Birmingham, United Kingdom

    2 publications · 57 citations

    2

    h-index

  2. PK
    Peter Kinnell

    Loughborough University, United Kingdom

    2 publications · 57 citations

    2

    h-index

  3. PD
    Peter Docker

    University of Hull, United Kingdom

    2 publications · 57 citations

    2

    h-index

  4. LM
    Lawrence M. Wein

    Stanford University, United States

    1 publications · 23 citations

    1

    h-index

  5. CA
    C.L.J. Adkins

    Princeton University, United States

    1 publications · 26 citations

    1

    h-index

1–5 of 62

Institutions

33

  1. University of Birmingham

    Birmingham, United Kingdom

    2 h-index

    6 publications

    171 citations

  2. Catholic University of America

    Washington D.C., United States

    1 h-index

    1 publications

    18 citations

  3. New Leaders

    New York, United States

    1 h-index

    1 publications

    23 citations

  4. University of Michigan

    Ann Arbor, United States

    1 h-index

    2 publications

    32 citations

  5. University of America

    Murrieta, United States

    1 h-index

    1 publications

    18 citations

  6. University of Neuchâtel

    Neuchâtel, Switzerland

    1 h-index

    5 publications

    215 citations

  7. Samsung (South Korea)

    Seoul, South Korea

    1 h-index

    1 publications

    75 citations

  8. Ascamm Technologic Center

    Cerdanyola del Vallès, Spain

    1 h-index

    1 publications

    16 citations

1–8 of 33

Venues

  1. Journal of Microelectromechanical Systems

    4 publications · 118 citations

    4

    h-index

  2. Journal of Micromechanics and Microengineering

    JMM · 2 publications · 57 citations

    2

    h-index

  3. 2

    h-index

  4. 1

    h-index

  5. 1

    h-index

1–5