Thermal Spreading is a thermal management phenomenon characterized by the lateral conduction of heat across a material or interface, thereby reducing localized temperature gradients by distributing thermal energy over a larger area.
130
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168
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2017–2026
27
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Publications
130
Thermal properties of very fast transistors
R. Joy, E.S. Schlig · IEEE Transactions on Electron Devices · 1970 · 161 citations
1–5 of 130
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431
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1–5 of 431
Institutions
168
Chinese Academy of Sciences
Beijing, China
7 h-index
42 publications
2.5K citations
Memorial University of Newfoundland
St. John's, Canada
6 h-index
8 publications
417 citations
Centre National de la Recherche Scientifique
Paris, France
6 h-index
29 publications
1.3K citations
University of Waterloo
Waterloo, Canada
6 h-index
12 publications
487 citations
Tsinghua University
Beijing, China
6 h-index
15 publications
674 citations
IMEC
Leuven, Belgium
5 h-index
32 publications
561 citations
Mississippi State University
Starkville, United States
4 h-index
5 publications
70 citations
Ningbo Institute of Industrial Technology
Ningbo, China
4 h-index
38 publications
2.3K citations
1–8 of 168
Venues
- International Journal of Heat and Mass Transfer
9 publications · 432 citations
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- IEEE Transactions on Electron Devices
9 publications · 552 citations
9
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- Applied Thermal Engineering
8 publications · 520 citations
8
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- IEEE Transactions on Components Packaging and Manufacturing Technology
5 publications · 222 citations
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- Journal of Electronic Packaging
4 publications · 129 citations
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