Concepedia

Temperature-dependent Bonding Kinetics

Temperature-Dependent Bonding Kinetics is a kinetic model that describes the rate of interfacial diffusion and bonding evolution in solid-state joining processes as a function of temperature, distinguished by its explicit incorporation of thermal activation energy to predict microstructural and bond strength changes during diffusion bonding.

153

Publications

7.2K

Citations

484

Authors

186

Institutions

Publications per year

2017–2026

26

Parents

Publications

153

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

, , +11

A Model for the Silicon Wafer Bonding Process

R. Stengl, T. Y. Tan, U. Gösele · Japanese Journal of Applied Physics · 1989 · 277 citations

, , +16

A laboratory investigation of steel to fly ash-based geopolymer paste bonding behavior after exposure to elevated temperatures

Xi Jiang, Rui Xiao, Miaomiao Zhang et al. · Construction and Building Materials · 2020 · 235 citations

, , +12

Theoretical model for diffusion bonding

Brian Derby, E. R. Wallach · Metal Science · 1982 · 230 citations

, , +17

Hydrogen bonding in liquid methanol

Mitsuhiro Matsumoto, Keith E. Gubbins · The Journal of Chemical Physics · 1990 · 203 citations

, , +17

1–5 of 153

Authors

484

  1. SF
    Stephen F. Corbin

    University of Waterloo, Canada

    3 publications · 99 citations

    3

    h-index

  2. SM
    S. Murali

    ASM International, United States

    3 publications · 156 citations

    3

    h-index

  3. SJ
    Seung‐Boo Jung

    Sungkyunkwan University, South Korea

    3 publications · 207 citations

    3

    h-index

  4. SC
    Sinn-wen Chen

    National Tsing Hua University, Taiwan

    3 publications · 84 citations

    3

    h-index

  5. JY
    Jeong‐Won Yoon

    Sungkyunkwan University, South Korea

    3 publications · 207 citations

    3

    h-index

1–5 of 484

Institutions

186

  1. National Tsing Hua University

    Hsinchu, Taiwan

    5 h-index

    11 publications

    261 citations

  2. The University of Osaka

    Osaka, Japan

    5 h-index

    20 publications

    457 citations

  3. Sungkyunkwan University

    Seoul, South Korea

    4 h-index

    9 publications

    637 citations

  4. Singapore Institute of Manufacturing Technology

    Singapore, Singapore

    4 h-index

    7 publications

    194 citations

  5. Northwestern Polytechnical University

    Xi'an, China

    3 h-index

    11 publications

    315 citations

  6. National Institute of Standards and Technology

    Gaithersburg, United States

    3 h-index

    6 publications

    220 citations

  7. University of Waterloo

    Waterloo, Canada

    3 h-index

    9 publications

    218 citations

  8. Central South University

    Changsha, China

    3 h-index

    10 publications

    212 citations

1–8 of 186

Venues

  1. Metallurgical and Materials Transactions A

    7 publications · 212 citations

    7

    h-index

  2. Materials Science and Engineering A

    6 publications · 310 citations

    6

    h-index

  3. Journal of Alloys and Compounds

    6 publications · 275 citations

    6

    h-index

  4. Microelectronics Reliability

    6 publications · 136 citations

    6

    h-index

  5. Journal of Materials Processing Technology

    5 publications · 214 citations

    5

    h-index

1–5