T. B. Massalski

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 329 citations

Materials Science, Materials Engineering, Engineering +5

Thermodynamically Improbable Phase Diagrams

H. Okamoto, T. B. Massalski · Journal of Phase Equilibria · 1991 · 249 citations · Full text

Engineering, Physics, Improbable Phase Diagrams +5

The Au−Cu (Gold-Copper) system

H. Okamoto, Debalay Chakrabarti, David E. Laughlin et al. · Journal of Phase Equilibria · 1987 · 220 citations

Engineering, Physics, Metal Nanoparticles +4

The Au−Si (Gold-Silicon) system

H. Okamoto, T. B. Massalski · Bulletin of Alloy Phase Diagrams · 1983 · 197 citations

Semiconductor Device Fabrication, Applied Physics

guidelines for binary phase diagram assessment

H. Okamoto, T. B. Massalski · Journal of Phase Equilibria · 1993 · 157 citations · Full text

Engineering, Measurement, Calibration +9