Concepedia

Substrate Lapping

Substrate Lapping is a precision surface preparation technique that belongs to the class of substrate preparation methods, distinguished by its use of abrasive action between a rotating lap and the substrate to achieve fine surface planarization and controlled material removal at the micro- to nanoscale level.

25

Publications

937

Citations

98

Authors

31

Institutions

Publications per year

2017–2026

9

Parents

Publications

25

Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes

Shengyi Li, Zhuo Wang, Yulie Wu · Journal of Materials Processing Technology · 2007 · 213 citations

, , +17

Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates

Hyuk-Min Kim, R. Manivannan, Deog-Ju Moon et al. · Wear · 2012 · 74 citations

, , +14

On the mechanism of material removal by fixed abrasive lapping of various glass substrates

Byoung-Jun Cho, Hyuk-Min Kim, R. Manivannan et al. · Wear · 2012 · 62 citations

, , +14

Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing

Bo Pan, Renke Kang, Jiang Guo et al. · Journal of Manufacturing Processes · 2019 · 59 citations

, , +15

Comparison of lapping performance between fixed agglomerated diamond pad and fixed single crystal diamond pad

Zikun Wang, Fengli Niu, Yongwei Zhu et al. · Wear · 2019 · 50 citations

, , +6

1–5 of 25

Authors

98

  1. BP
    Bo Pan

    Dalian University of Technology, China

    2 publications · 81 citations

    2

    h-index

  2. KI
    Kouji Inagaki

    The University of Osaka, Japan

    2 publications · 35 citations

    2

    h-index

  3. KA
    Kenta Arima

    The University of Osaka, Japan

    2 publications · 35 citations

    2

    h-index

  4. HK
    Hyuk-Min Kim

    Hanyang University, South Korea

    2 publications · 136 citations

    2

    h-index

  5. RM
    R. Manivannan

    National Institute of Technology Raipur, India

    2 publications · 136 citations

    2

    h-index

1–5 of 98

Institutions

31

  1. Brunel University of London

    London, United Kingdom

    2 h-index

    2 publications

    70 citations

  2. Huaqiao University

    Xiamen, China

    2 h-index

    9 publications

    204 citations

  3. China Academy of Engineering Physics

    Mianyang, China

    2 h-index

    4 publications

    162 citations

  4. The University of Osaka

    Osaka, Japan

    2 h-index

    22 publications

    385 citations

  5. Hanyang University

    Seoul, South Korea

    2 h-index

    10 publications

    680 citations

  6. Ebara (Japan)

    Tokyo, Japan

    2 h-index

    2 publications

    35 citations

  7. Dalian University of Technology

    Dalian, China

    2 h-index

    8 publications

    324 citations

  8. Nanjing University of Aeronautics and Astronautics

    Nanjing, China

    2 h-index

    10 publications

    370 citations

1–8 of 31

Venues

  1. Wear

    4 publications · 218 citations

    4

    h-index

  2. Journal of Materials Processing Technology

    3 publications · 273 citations

    3

    h-index

  3. 2

    h-index

  4. CIRP Annals

    2 publications · 51 citations

    2

    h-index

  5. 2

    h-index

1–5