Renke Kang

Changes in surface layer of silicon wafers from diamond scratching

Zhenyu Zhang, Bo Wang, Renke Kang et al. · CIRP Annals · 2015 · 231 citations

Materials Science, Diamond-like Carbon, Wafer Scale Processing +6

A novel approach of mechanical chemical grinding

Zhenyu Zhang, Junfeng Cui, Bo Wang et al. · Journal of Alloys and Compounds · 2017 · 172 citations

Materials Science, Engineering, Mechanical Chemical Grinding +5

A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut

Zhenyu Zhang, Dongming Guo, Bo Wang et al. · Scientific Reports · 2015 · 154 citations · Full text

Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing

Shang Gao, Honggang Li, Han Huang et al. · Applied Surface Science · 2022 · 144 citations

Materials Science, Materials Engineering, Silicon Wafers +12

Novel rotating-vibrating magnetic abrasive polishing method for double-layered internal surface finishing

Jiang Guo, Ka Hing Au, Chen‐Nan Sun et al. · Journal of Materials Processing Technology · 2018 · 139 citations

Materials Science, Magnetism, Engineering +9