Byoung-Jun Cho

Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process

Byoung-Jun Cho, Shohei Shima, Satomi Hamada et al. · Applied Surface Science · 2016 · 94 citations

Natural Sciences, Materials Engineering, Materials Science +14

On the mechanism of material removal by fixed abrasive lapping of various glass substrates

Byoung-Jun Cho, Hyuk-Min Kim, R. Manivannan et al. · Wear · 2012 · 62 citations

Engineering, Materials Engineering, Materials Science +14

Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning

Heon-Yul Ryu, Byoung-Jun Cho, Nagendra Prasad Yerriboina et al. · ECS Journal of Solid State Science and Technology · 2019 · 55 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation

BVS Praveen, Byoung-Jun Cho, Jin-Goo Park · Materials Science in Semiconductor Processing · 2015 · 50 citations

Natural Sciences, Materials Engineering, Materials Science +17

Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

Hyuk-Min Kim, Gun-Ho Park, Young-Gil Seo et al. · Wear · 2015 · 50 citations · Full text

Engineering, Materials Engineering, Materials Science +12