Nagendra Prasad Yerriboina

Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning

Samrina Sahir, Nagendra Prasad Yerriboina, So-Young Han et al. · Applied Surface Science · 2021 · 56 citations

Materials Science, Materials Engineering, Wafer Scale Processing +10

Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning

Heon-Yul Ryu, Byoung-Jun Cho, Nagendra Prasad Yerriboina et al. · ECS Journal of Solid State Science and Technology · 2019 · 54 citations · Full text

Materials Science, Copper Cmp, Chemical Engineering +15

Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process

Kwang-Min Han, So-Young Han, Samrina Sahir et al. · ECS Journal of Solid State Science and Technology · 2020 · 39 citations

Engineering, Contamination Behavior, Chemistry +16

A Breakthrough Method for the Effective Conditioning of PVA Brush Used for Post-CMP Process

Jung‐Hwan Lee, Heon-Yul Ryu, Jun-Kil Hwang et al. · ECS Journal of Solid State Science and Technology · 2019 · 33 citations · Full text

Breakthrough Method, Chemical Engineering, Self-cleaning Surface +15

Tungsten passivation layer (WO3) formation mechanisms during chemical mechanical planarization in the presence of oxidizers

Maneesh Kumar Poddar, Palwasha Jalalzai, Samrina Sahir et al. · Applied Surface Science · 2020 · 32 citations

Materials Engineering, Materials Science, Chemical Engineering +9