Satomi Hamada

Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process

Byoung-Jun Cho, Shohei Shima, Satomi Hamada et al. · Applied Surface Science · 2016 · 94 citations

Natural Sciences, Materials Engineering, Materials Science +14

Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning

Heon-Yul Ryu, Byoung-Jun Cho, Nagendra Prasad Yerriboina et al. · ECS Journal of Solid State Science and Technology · 2019 · 55 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

A Breakthrough Method for the Effective Conditioning of PVA Brush Used for Post-CMP Process

Jung‐Hwan Lee, Heon-Yul Ryu, Jun-Kil Hwang et al. · ECS Journal of Solid State Science and Technology · 2019 · 35 citations · Full text

Engineering, Materials Engineering, Materials Science +17

A Water Polishing Process to Improve Ceria Abrasive Removal

Seok‐Jun Hong, Juhwan Kim, Johee Won et al. · ECS Journal of Solid State Science and Technology · 2019 · 27 citations

Engineering, Materials Engineering, Materials Science +17

Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process

Jung‐Hwan Lee, Maneesh Kumar Poddar, Kwang-Min Han et al. · Polymer Testing · 2020 · 22 citations

Architecture, Environmental Sciences, Water Treatment +14