Publication | Closed Access
Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing
59
Citations
17
References
2019
Year
Materials ScienceMetal ProcessingEngineeringNanolithography MethodMicrofabricationMechanical EngineeringApplied PhysicsSurface SciencePrinted ElectronicsFabrication TechniquePrecision FabricationElectronic PackagingThin Copper SubstrateSurface Processing3D PrintingChemical Mechanical
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