Self-aligned Processes

Self-Aligned Processes is a fabrication methodology in semiconductor manufacturing that belongs to the class of patterning techniques and is distinguished by its inherent alignment of successive material layers or features through a common, automatically registered process sequence, thereby eliminating the need for external alignment markers or overlay lithography.

180

Publications

6.5K

Citations

911

Authors

195

Institutions

Publications per year

2017–2026

21

Authors

911

  1. SK
    S. Konaka

    NTT Basic Research Laboratories, Japan

    6 publications · 312 citations

    6

    h-index

  2. MS
    Masao Suzuki

    NOF Corporation (Japan), Japan

    4 publications · 192 citations

    4

    h-index

  3. JL
    Jianqiang Lin

    Massachusetts Institute of Technology, United States

    4 publications · 128 citations

    4

    h-index

  4. TS
    T. Sakai

    NTT Basic Research Laboratories, Japan

    4 publications · 172 citations

    4

    h-index

  5. SN
    Sakurako Natori

    Tokyo Electron (Japan), Japan

    3 publications · 48 citations

    3

    h-index

1–5 of 911

Venues

  1. IEEE Transactions on Electron Devices

    21 publications · 845 citations

    16

    h-index

  2. IEEE Electron Device Letters

    17 publications · 580 citations

    15

    h-index

  3. Applied Physics Letters

    13 publications · 466 citations

    11

    h-index

  4. 10

    h-index

  5. IEEE Journal of Solid-State Circuits

    7 publications · 214 citations

    7

    h-index

1–5