Release Layer Engineering

Release Layer Engineering is a methodological framework in wafer bonding that involves the design and optimization of sacrificial layers to enable controlled, defect-minimized separation of bonded substrates while preserving structural integrity and interfacial quality.

18

Publications

977

Citations

90

Authors

28

Institutions

Publications per year

2017–2026

3

Authors

90

  1. JT
    Jun Taniguchi

    Tokyo University of Science, Japan

    3 publications · 48 citations

    3

    h-index

  2. TM
    Toshiki Makimōto

    NTT Basic Research Laboratories, Japan

    2 publications · 481 citations

    2

    h-index

  3. KK
    Kazuhide Kumakura

    NTT Basic Research Laboratories, Japan

    2 publications · 481 citations

    2

    h-index

  4. TA
    Tetsuya Akasaka

    NTT Basic Research Laboratories, Japan

    2 publications · 481 citations

    2

    h-index

  5. YK
    Yasuyuki Kobayashi

    NTT Basic Research Laboratories, Japan

    2 publications · 481 citations

    2

    h-index

1–5 of 90

Venues

  1. Microelectronic Engineering

    2 publications · 36 citations

    2

    h-index

  2. 2

    h-index

  3. ACS Applied Materials & Interfaces

    2 publications · 40 citations

    2

    h-index

  4. Nano Energy

    1 publications · 72 citations

    1

    h-index

  5. Applied Physics Express

    APEX · 1 publications · 52 citations

    1

    h-index

1–5