Release Layer Engineering
Release Layer Engineering is a methodological framework in wafer bonding that involves the design and optimization of sacrificial layers to enable controlled, defect-minimized separation of bonded substrates while preserving structural integrity and interfacial quality.
18
Publications
977
Citations
90
Authors
28
Institutions
Publications per year
2017–2026
3
Parents
18
1–5 of 18
90
3
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2
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2
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2
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2
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1–5 of 90
28
Tokyo University of Science
Tokyo, Japan
3 h-index
6 publications
96 citations
NTT Basic Research Laboratories
Atsugi, Japan
2 h-index
9 publications
2K citations

Japan Society for the Promotion of Science
Tokyo, Japan
2 h-index
2 publications
31 citations

National Taiwan University
Taipei, Taiwan
1 h-index
3 publications
114 citations

Heriot-Watt University
Edinburgh, United Kingdom
1 h-index
6 publications
216 citations
Georgia Institute of Technology
Atlanta, United States
1 h-index
5 publications
140 citations
University of Illinois Urbana-Champaign
Urbana, United States
1 h-index
4 publications
224 citations

Hiroshima University
Hiroshima, Japan
1 h-index
7 publications
259 citations
1–8 of 28
2 publications · 36 citations
2
h-index
2 publications · 55 citations
2
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2 publications · 40 citations
2
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1 publications · 72 citations
1
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APEX · 1 publications · 52 citations
1
h-index
1–5