Concepedia

Protective Packaging For Electronics

Protective Packaging for Electronics is a specialized form of protective packaging designed to safeguard electronic components and devices from environmental, mechanical, and electrostatic hazards during storage, handling, and transportation, distinguished by its integration of materials and structural features that mitigate electrical conductivity, moisture ingress, and impact forces specific to electronic systems.

30

Publications

1.9K

Citations

104

Authors

38

Institutions

Publications per year

2017–2026

5

Parents

Publications

30

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Yi Li, C.P. Wong · Materials Science and Engineering R Reports · 2006 · 706 citations

, , +17

Recent advances in isotropic conductive adhesives for electronics packaging applications

Irfan Ahmad Mir, Devendra Kumar · International Journal of Adhesion and Adhesives · 2007 · 200 citations

, , +16

High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging

Chao Chen, Yongjun Tang, Yunsheng Ye et al. · Composites Science and Technology · 2014 · 177 citations

, , +15

An overview of multimedia content protection in consumer electronics devices

Ahmet M. Eskicioğlu, Edward J. Delp · Signal Processing Image Communication · 2001 · 155 citations

, , +14

On the Operation of a Press Pack IGBT Module Under Short Circuit Conditions

Satish Gunturi, Daniel Schneider · IEEE Transactions on Advanced Packaging · 2006 · 87 citations

, , +17

1–5 of 30

Authors

104

  1. ER
    Elyse Rosenbaum

    University of Illinois Urbana-Champaign, United States

    3 publications · 41 citations

    3

    h-index

  2. PA
    Paul A. Sullivan

    HRL Laboratories (United States), United States

    2 publications · 80 citations

    2

    h-index

  3. JP
    Jim Papadopoulos

    Northeastern University, United States

    2 publications · 80 citations

    2

    h-index

  4. SG
    Suresh Goyal

    University of Limerick, Ireland

    2 publications · 80 citations

    2

    h-index

  5. DL
    D.L. Lin

    AT&T (United States), United States

    1 publications · 10 citations

    1

    h-index

1–5 of 104

Institutions

38

  1. University of Illinois Urbana-Champaign

    Urbana, United States

    3 h-index

    10 publications

    139 citations

  2. Huazhong University of Science and Technology

    Wuhan, China

    2 h-index

    7 publications

    1.1K citations

  3. Motorola (United States)

    Schaumburg, United States

    2 h-index

    4 publications

    41 citations

  4. Nitto (Japan)

    Fukayachō, Japan

    1 h-index

    3 publications

    75 citations

  5. Taiwan Semiconductor Manufacturing Company (Taiwan)

    Hsinchu, Taiwan

    1 h-index

    5 publications

    75 citations

  6. ABB (Switzerland)

    Zurich, Switzerland

    1 h-index

    2 publications

    174 citations

  7. Purdue University West Lafayette

    West Lafayette, United States

    1 h-index

    1 publications

    155 citations

  8. University of California, Davis

    Davis, United States

    1 h-index

    1 publications

    26 citations

1–8 of 38

Venues

  1. Journal of Electrostatics

    2 publications · 34 citations

    2

    h-index

  2. Polymer

    2 publications · 82 citations

    2

    h-index

  3. Electrical Overstress/Electrostatic Discharge Symposium

    Conference · 2 publications · 21 citations

    2

    h-index

  4. IEEE Transactions on Advanced Packaging

    1 publications · 87 citations

    1

    h-index

  5. IEEE Microwave Magazine

    1 publications · 26 citations

    1

    h-index

1–5