Concepedia

Packaging Prototyping

Packaging Prototyping is a design development process that involves the creation of preliminary physical or digital models of packaging to evaluate functional, structural, and aesthetic characteristics prior to final production.

34

Publications

1.1K

Citations

140

Authors

62

Institutions

Publications per year

2017–2026

11

Parents

Children

Publications

34

3D-Printed Origami Packaging With Inkjet-Printed Antennas for RF Harvesting Sensors

John Kimionis, Michael Isakov, Beom S. Koh et al. · IEEE Transactions on Microwave Theory and Techniques · 2015 · 162 citations

, , +16

Exploring the use of AR technology for co-creative product and packaging design

Gaetano Cascini, Jamie O’Hare, Elies Dekoninck et al. · Computers in Industry · 2020 · 82 citations · Full text

, , +16

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Tz-Cheng Chiu, En-Yu Yeh · Microelectronics Reliability · 2017 · 66 citations

, , +16

THE PROCESS OF LOGISTICAL PACKAGING INNOVATION.

Diana Twede · Journal of Business Logistics · 1992 · 56 citations

, , +10

Laser-assisted ultrathin die packaging: Insights from a process study

V. Marinov, Orven F. Swenson, Yuriy Atanasov et al. · Microelectronic Engineering · 2012 · 53 citations

, , +12

1–5 of 34

Authors

140

  1. RS
    Rapinder Sawhney

    University of Tennessee at Knoxville, United States

    1 publications · 12 citations

    1

    h-index

  2. SK
    Sanghoo Kim

    Sejong University, South Korea

    1 publications · 15 citations

    1

    h-index

  3. DT
    Diana Twede

    Michigan State University, United States

    1 publications · 56 citations

    1

    h-index

  4. YS
    Yong-Ho Seo

    University of Warsaw, Poland

    1 publications · 15 citations

    1

    h-index

  5. JB
    Jean-François Boujut

    Laboratoire des Sciences pour la Conception, l'Optimisation et la Production, France

    1 publications · 82 citations

    1

    h-index

1–5 of 140

Institutions

62

  1. National Cheng Kung University

    Tainan City, Taiwan

    2 h-index

    4 publications

    184 citations

  2. University of Bath

    Bath, United Kingdom

    2 h-index

    8 publications

    326 citations

  3. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    1 h-index

    2 publications

    22 citations

  4. Intel (United States)

    Santa Clara, United States

    1 h-index

    2 publications

    42 citations

  5. Valtronic (Switzerland)

    Le Vaud, Switzerland

    1 h-index

    4 publications

    68 citations

  6. Texas Instruments (United States)

    Dallas, United States

    1 h-index

    2 publications

    24 citations

  7. Delft University of Technology

    Delft, The Netherlands

    1 h-index

    1 publications

    11 citations

  8. Laboratoire des Sciences pour la Conception, l'Optimisation et la Production

    Grenoble, France

    1 h-index

    2 publications

    164 citations

1–8 of 62

Venues

  1. Microelectronics Reliability

    2 publications · 76 citations

    2

    h-index

  2. MRS Proceedings

    2 publications · 34 citations

    2

    h-index

  3. Microelectronic Engineering

    2 publications · 79 citations

    2

    h-index

  4. Journal of Food Engineering

    1 publications · 29 citations

    1

    h-index

  5. Journal of Polymers and the Environment

    1 publications · 30 citations

    1

    h-index

1–5