Concepedia

Packaging Compatibility

Packaging Compatibility is a pharmaceutical packaging principle that denotes the capacity of packaging materials and systems to maintain the chemical, physical, and microbiological integrity of a drug product throughout its shelf life without inducing adverse interactions.

56

Publications

1.6K

Citations

203

Authors

68

Institutions

Publications per year

2017–2026

12

Variants

Container-closure Compatibility

Parents

Children

Publications

56

Compatibility of biodegradable poly (lactic acid) (PLA) and poly (butylene succinate) (PBS) blends for packaging application

Amita Bhatia, Rahul K. Gupta, Sati N. Bhattacharya et al. · RMIT Research Repository (RMIT University Library) · 2007 · 273 citations

, , +15

Chip-packaging interaction: a critical concern for Cu/low k packaging

Guotao Wang, Paul S. Ho, Steven K. Groothuis · Microelectronics Reliability · 2005 · 109 citations

, , +15

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

J. Liu, A. Tolvgard, J. Malmodin et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 106 citations

, , +17

Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications

Xiaohan Li, Yanglong Zhou, Ying Bao et al. · Industrial & Engineering Chemistry Research · 2022 · 60 citations

, , +15

Avoiding packaging mismatch with flexible packaging

Robert DeLine · 1999 · 50 citations

, , +7

1–5 of 56

Authors

203

  1. SZ
    Shuye Zhang

    Harbin Institute of Technology, China

    2 publications · 52 citations

    3

    h-index

  2. PH
    Peng He

    Harbin Institute of Technology, China

    1 publications · 26 citations

    3

    h-index

  3. RD
    Robert DeLine

    Microsoft (United States), United States

    2 publications · 69 citations

    2

    h-index

  4. ZL
    Z. Lai

    Chalmers University of Technology, Sweden

    2 publications · 128 citations

    2

    h-index

  5. XJ
    Xinyi Jing

    Harbin Institute of Technology, China

    1 publications · 26 citations

    2

    h-index

1–5 of 203

Institutions

68

  1. Carnegie Mellon University

    Pittsburgh, United States

    3 h-index

    3 publications

    105 citations

  2. Harbin Institute of Technology

    Harbin, China

    3 h-index

    7 publications

    182 citations

  3. Jiangnan University

    Wuxi, China

    2 h-index

    7 publications

    388 citations

  4. Shanghai University of Engineering Science

    Shanghai, China

    2 h-index

    2 publications

    52 citations

  5. Ericsson (Sweden)

    Kista, Sweden

    2 h-index

    2 publications

    128 citations

  6. Swedish Institute

    Stockholm, Sweden

    2 h-index

    5 publications

    362 citations

  7. Infineon Technologies (Germany)

    Munich, Germany

    2 h-index

    10 publications

    130 citations

  8. Chalmers University of Technology

    Gothenburg, Sweden

    2 h-index

    5 publications

    166 citations

1–8 of 68

Venues

  1. Microelectronics Reliability

    6 publications · 212 citations

    6

    h-index

  2. 3

    h-index

  3. Journal of Electronic Materials

    JEM · 3 publications · 43 citations

    3

    h-index

  4. Microelectronic Engineering

    2 publications · 43 citations

    2

    h-index

  5. 2

    h-index

1–5