Concepedia

Packaging Adhesives

Packaging Adhesives is a specialized class of bonding materials designed to join packaging components by adhering dissimilar substrates, distinguished from other adhesives by its formulation to meet specific performance, safety, and regulatory requirements inherent to packaging applications.

33

Publications

1.5K

Citations

129

Authors

42

Institutions

Publications per year

2017–2026

8

Parents

Publications

33

Moisture transport, adhesion, and corrosion protection of PV module packaging materials

G. Jörgensen, Kent Terwilliger, J. DelCueto et al. · Solar Energy Materials and Solar Cells · 2006 · 201 citations

, , +16

Recent advances in isotropic conductive adhesives for electronics packaging applications

Irfan Ahmad Mir, Devendra Kumar · International Journal of Adhesion and Adhesives · 2007 · 200 citations

, , +16

Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications

Rongwei Zhang, Wei Lin, Kevin Lawrence et al. · International Journal of Adhesion and Adhesives · 2010 · 100 citations

, , +14

Migration studies and toxicity evaluation of cyclic polyesters oligomers from food packaging adhesives

Sara Úbeda, Margarita Aznar, Anna Kjerstine Rosenmai · Food Chemistry · 2019 · 75 citations · Full text

, , +17

Lactic acid based polymers as hot melt adhesives for packaging applications

M Viljanmaa, Anders Södergård, P. Törmälä · International Journal of Adhesion and Adhesives · 2002 · 71 citations

, , +16

1–5 of 33

Authors

129

  1. RA
    Rose Ann Schultz

    University of Maryland, College Park, United States

    1 publications · 24 citations

    1

    h-index

  2. YL
    Yinghui Li

    Southwest Jiaotong University, China

    1 publications · 43 citations

    1

    h-index

  3. HK
    Hyun‐Joong Kim

    Seoul National University, South Korea

    1 publications · 53 citations

    1

    h-index

  4. CM
    Chong M. Lee

    University of Rhode Island, United States

    1 publications · 70 citations

    1

    h-index

  5. FJ
    F. J. Pern

    National Laboratory of the Rockies, United States

    1 publications · 201 citations

    1

    h-index

1–5 of 129

Institutions

42

  1. Georgia Institute of Technology

    Atlanta, United States

    2 h-index

    5 publications

    418 citations

  2. University of Southampton

    Southampton, United Kingdom

    2 h-index

    5 publications

    93 citations

  3. Universidad de Zaragoza

    Zaragoza, Spain

    2 h-index

    3 publications

    196 citations

  4. Seoul National University

    Seoul, South Korea

    1 h-index

    5 publications

    265 citations

  5. University of Rhode Island

    Kingston, United States

    1 h-index

    1 publications

    70 citations

  6. Sumitomo Osaka Cement (Japan)

    Sano, Japan

    1 h-index

    5 publications

    115 citations

  7. Texas Instruments (United States)

    Dallas, United States

    1 h-index

    3 publications

    30 citations

  8. Hanyang University

    Seoul, South Korea

    1 h-index

    2 publications

    46 citations

1–8 of 42

Venues

  1. 7

    h-index

  2. Electronic Materials Letters

    EML · 2 publications · 46 citations

    2

    h-index

  3. Polymers for Advanced Technologies

    PAT · 1 publications · 24 citations

    1

    h-index

  4. Journal of Solid State Lighting

    1 publications · 18 citations

    1

    h-index

  5. Applied Surface Science

    1 publications · 36 citations

    1

    h-index

1–5