Interconnect Inductance Modeling

Interconnect Inductance Modeling is a computational modeling technique that characterizes the parasitic inductance of on-chip interconnects to enable accurate prediction and analysis of electromagnetic effects in high-speed integrated circuit design.

348

Publications

17.2K

Citations

868

Authors

259

Institutions

Publications per year

2017–2026

25

Authors

868

  1. EG
    Eby G. Friedman

    University of Rochester, United States

    14 publications · 927 citations

    12

    h-index

  2. JW
    Jacob White

    Massachusetts Institute of Technology, United States

    12 publications · 523 citations

    11

    h-index

  3. JL
    James L. Drewniak

    Missouri University of Science and Technology, United States

    11 publications · 402 citations

    11

    h-index

  4. JF
    Jun Fan

    Missouri University of Science and Technology, United States

    10 publications · 455 citations

    10

    h-index

  5. MK
    M. Kamon

    Massachusetts Institute of Technology, United States

    9 publications · 398 citations

    9

    h-index

1–5 of 868

Venues

  1. 15

    h-index

  2. 14

    h-index

  3. IEEE Transactions on Electron Devices

    13 publications · 1.6K citations

    13

    h-index

  4. 11

    h-index

  5. IEEE Transactions on Advanced Packaging

    9 publications · 376 citations

    9

    h-index

1–5