Concepedia

3D Stacked Memory

3D Stacked Memory is a memory subsystem architecture in which multiple layers of memory cells are vertically integrated using through-silicon vias and wafer-level bonding techniques, enabling high-bandwidth, low-latency data access through dense interlayer connectivity.

317

Publications

16.6K

Citations

1.9K

Authors

258

Institutions

Publications per year

2017–2026

111

Variants

Three-dimensional Stacked Memory

Parents

Publications

317

3D-Stacked Memory Architectures for Multi-core Processors

Gabriel H. Loh · ACM SIGARCH Computer Architecture News · 2008 · 543 citations

, , +16

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology

Uksong Kang, Hoeju Chung, Seongmoo Heo et al. · IEEE Journal of Solid-State Circuits · 2010 · 487 citations

, , +15

A novel architecture of the 3D stacked MRAM L2 cache for CMPs

Guangyu Sun, Xiangyu Dong, Yuan Xie et al. · 2009 · 439 citations

, , +17

3D-Stacked Memory Architectures for Multi-core Processors

Gabriel H. Loh · 2008 · 436 citations

, , +16

Neurocube

Duck-Hwan Kim, Jaeha Kung, Sek Chai et al. · ACM SIGARCH Computer Architecture News · 2016 · 355 citations

, , +17

1–5 of 317

Authors

1.9K

  1. YX
    Yuan Xie

    Pennsylvania State University, United States

    20 publications · 1.4K citations

    17

    h-index

  2. OM
    Onur Mutlu

    Carnegie Mellon University, United States

    18 publications · 1.5K citations

    17

    h-index

  3. GS
    Guangyu Sun

    Peking University, China

    9 publications · 1K citations

    9

    h-index

  4. GH
    Gabriel H. Loh

    Advanced Micro Devices (Canada), Canada

    9 publications · 1.4K citations

    9

    h-index

  5. SG
    Saugata Ghose

    Carnegie Mellon University, United States

    9 publications · 728 citations

    9

    h-index

1–5 of 1.9K

Institutions

258

  1. Samsung (South Korea)

    Seoul, South Korea

    19 h-index

    377 publications

    33.3K citations

  2. Georgia Institute of Technology

    Atlanta, United States

    19 h-index

    115 publications

    10.9K citations

  3. Carnegie Mellon University

    Pittsburgh, United States

    18 h-index

    76 publications

    7.4K citations

  4. Pennsylvania State University

    State College, United States

    15 h-index

    53 publications

    5.3K citations

  5. SK Group (South Korea)

    Seoul, South Korea

    13 h-index

    160 publications

    5.3K citations

  6. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    12 h-index

    44 publications

    2.2K citations

  7. Seoul National University

    Seoul, South Korea

    12 h-index

    46 publications

    1.5K citations

  8. ETH Zurich

    Zurich, Switzerland

    11 h-index

    19 publications

    1.4K citations

1–8 of 258

Venues

  1. IEEE Transactions on Electron Devices

    10 publications · 405 citations

    9

    h-index

  2. arXiv (Cornell University)

    Repository · 7 publications · 187 citations

    7

    h-index

  3. IEEE Journal of Solid-State Circuits

    7 publications · 761 citations

    7

    h-index

  4. ACM SIGARCH Computer Architecture News

    5 publications · 1.2K citations

    5

    h-index

  5. ACM Transactions on Architecture and Code Optimization

    TACO · 5 publications · 258 citations

    5

    h-index

1–5