Andrew Stamper

Reduced Cu interface diffusion by CoWP surface coating

C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Microelectronic Engineering · 2003 · 109 citations

Materials Science, Engineering, Corrosion +5

Sputter deposition of YBa2Cu3O6+<i>x</i> on alumina and the influence of ZrO2 buffer layers

Andrew Stamper, David W. Greve, Daw-Heng Wong et al. · Applied Physics Letters · 1988 · 42 citations

Materials Science, Materials Engineering, Electrical Engineering +14

In-line E-beam wafer metrology and defect inspection: the end of an era for image-based critical dimensional metrology? New life for defect inspection

Eric Solecky, Oliver D. Patterson, Andrew Stamper et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2013 · 27 citations

Engineering, Electron-beam Lithography, Measurement +21

Bimodal electromigration mechanisms in dual-damascene Cu line/via on W

C.‐K. Hu, Lynne Gignac, E. Liniger et al. · 2003 · 14 citations

Engineering, Void Growth, Bimodal Electromigration Mechanisms +16

Process Window Centering for 22 nm Lithography

Ralf Buengener, Carol Boye, Bryan Rhoads et al. · IEEE Transactions on Semiconductor Manufacturing · 2011 · 11 citations

Engineering, Electron-beam Lithography, Pwc Methodology +10