Andrew Stamper - Concepedia

Author

Andrew Stamper

IBM (United States)

Also Known As

A. Stamper, Andrew D. Stamper, Andrew Stamper, Stamper, Andrew

Publications

288

Citations

H-Index

Concepts

All Affiliations

IBM (United States)GlobalFoundries (United States)

About

Andrew Stamper is an author at IBM (United States) specializing in applied physics, engineering, and surface science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	203
2	Applied Physics	5	5	203
3	Electrical Engineering	2	2	56
4	Education	1	1	27
5	Computer Engineering	1	1	11

Andrew Stamper

Publications

223

Citations

H-Index

Page 1

	Year	Citations
Reduced Cu interface diffusion by CoWP surface coating C.‐K. Hu, Lynne Gignac, R. Rosenberg, Microelectronic Engineering Materials ScienceEngineeringCorrosionSurface ScienceApplied Physics	2003	109
Sputter deposition of YBa2Cu3O6+<i>x</i> on alumina and the influence of ZrO2 buffer layers Andrew Stamper, David W. Greve, Daw-Heng Wong, Applied Physics Letters Materials ScienceMaterials EngineeringElectrical EngineeringZro2 Buffer LayerEngineering	1988	42
In-line E-beam wafer metrology and defect inspection: the end of an era for image-based critical dimensional metrology? New life for defect inspection Eric Solecky, Oliver D. Patterson, Andrew Stamper, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE EngineeringElectron-beam LithographyMeasurementMicroscopyDefect Inspection	2013	27
Bimodal electromigration mechanisms in dual-damascene Cu line/via on W C.‐K. Hu, Lynne Gignac, E. Liniger, EngineeringVoid GrowthBimodal Electromigration MechanismsFailure LifetimesNanoelectronics	2003	14
Process Window Centering for 22 nm Lithography Ralf Buengener, Carol Boye, Bryan Rhoads, IEEE Transactions on Semiconductor Manufacturing EngineeringElectron-beam LithographyPwc MethodologyMicrofabricationBeam Lithography	2011	11
In-line E-beam metrology and defect inspection: industry reflections, hybrid E-beam opportunities, recommendations and predictions Eric Solecky, Allen Rasafar, Jason Cantone, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE	2017	10
Improved Color Defect Detection With Machine Learning for After Develop Inspections in Lithography Matthew P. McLaughlin, Petra Mennell, Andrew Stamper, IEEE Transactions on Semiconductor Manufacturing	2022	10

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