DaeByoung Kang

Next generation fine pitch Cu Pillar technology — Enabling next generation silicon nodes

M. Gerber, C. Beddingfield, Shawn O’Connor et al. · 2011 · 101 citations

Engineering, Computer Engineering, Electrical Engineering +17

Study of interconnection process for fine pitch flip chip

Minjae Lee, Min Seok Yoo, J. Cho et al. · 2009 · 63 citations

Engineering, Electrical Engineering, Microelectronics +16

Application of through mold via (TMV) as PoP base package

Jinseong Kim, Kiwook Lee, Dongjoo Park et al. · 2008 · 54 citations

Engineering, Computer Engineering, Digital Fabrication +13

Multi-die chip on wafer thermo-compression bonding using non-conductive film

David Hiner, Dong Wook Kim, Seokgeun Ahn et al. · 2015 · 32 citations

Engineering, Materials Engineering, Materials Science +17

Wafer Level Multi-chip Gang Bonding Using TCNCF

Seokgeun Ahn, Hwankyu Kim, Dong Wook Kim et al. · 2016 · 23 citations

Engineering, Materials Engineering, Materials Science +16