Concepedia

Hwankyu Kim

HK

2

Publications

55

Citations

2

H-Index

2015

Active since

Affiliations

Qualcomm (United States)(Current)

Amkor Technology (United States)

Hwankyu Kim is an author at Qualcomm (United States) specializing in microfabrication, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingElectrical Engineering3D PrintingApplied PhysicsNanoelectronicsAdvanced Packaging

Publications per year

2015–2016

2

Publications

2

Multi-die chip on wafer thermo-compression bonding using non-conductive film

David Hiner, Dong Wook Kim, Seokgeun Ahn et al. · 2015 · 32 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Wafer Level Multi-chip Gang Bonding Using TCNCF

Seokgeun Ahn, Hwankyu Kim, Dong Wook Kim et al. · 2016 · 23 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

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