Concepedia

David Hiner

DH

3

Publications

85

Citations

3

H-Index

2015

Active since

Affiliations

Amkor Technology (United States)(Current)

Qualcomm (United States)

David Hiner is an author at Amkor Technology (United States) specializing in electrical engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMaterial ScienceMicrofabricationAdvanced PackagingIntegrated Circuits3D Printing3D Integration

Publications per year

2015–2017

3

Publications

3

Multi-die chip on wafer thermo-compression bonding using non-conductive film

David Hiner, Dong Wook Kim, Seokgeun Ahn et al. · 2015 · 32 citations

Materials Science, Materials Engineering, Electrical Engineering +15

SLIM (TM), High Density Wafer Level Fan-Out Package Development with Submicron RDL

YoungRae Kim, JaeHun Bae, MinHwa Chang et al. · 2017 · 30 citations

Engineering, Computer Architecture, Integrated Circuits +18

Wafer Level Multi-chip Gang Bonding Using TCNCF

Seokgeun Ahn, Hwankyu Kim, Dong Wook Kim et al. · 2016 · 23 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

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