S. Kadomura

Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

Y. Kagawa, Nobutoshi Fujii, Kenichi Aoyagi et al. · 2016 · 234 citations

Engineering, Materials Science, Electronic Materials +13

Radiation Damage of SiO₂ Surface Induced by Vacuum Ultraviolet Photons of High-Density Plasma

Tetsuya Tatsumi, Seiichi Fukuda, S. Kadomura · Japanese Journal of Applied Physics · 1994 · 94 citations

Natural Sciences, Electrical Engineering, Materials Science +17

An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor

Y. Kagawa, Nobutoshi Fujii, Kenichi Aoyagi et al. · 2018 · 47 citations

Engineering, Mechatronics Engineering, Electronic Materials +15

The Scaling of Cu-Cu Hybrid Bonding For High Density 3D Chip Stacking

Y. Kagawa, Sohta Hida, Yuka Kobayashi et al. · 2019 Electron Devices Technology and Manufacturing Conference (EDTM) · 2019 · 36 citations

Engineering, Electrical Engineering, Materials Science +17

Etch Rate Acceleration of SiO₂ during Wet Treatment after Gate Etching

Tetsuya Tatsumi, Seiichi Fukuda, S. Kadomura · Japanese Journal of Applied Physics · 1993 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17