Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

Y. Kagawa, Nobutoshi Fujii, Kenichi Aoyagi, +15

Electrical EngineeringNew CisEngineeringDevice IntegrationAdvanced Cu2cu Hybrid +6

Radiation Damage of SiO₂ Surface Induced by Vacuum Ultraviolet Photons of High-Density Plasma

Tetsuya Tatsumi, Seiichi Fukuda, S. Kadomura

Japanese Journal of Applied Physics

EngineeringPlasma PhysicsVacuum DeviceSilicon On InsulatorPlasma Electronics +14

An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor

Y. Kagawa, Nobutoshi Fujii, Kenichi Aoyagi, +14

Electrical EngineeringNew CisEngineeringDevice IntegrationAdvanced Packaging (Semiconductors) +7

The Scaling of Cu-Cu Hybrid Bonding For High Density 3D Chip Stacking

Y. Kagawa, Sohta Hida, Yuka Kobayashi, +11

2019 Electron Devices Technology and Manufacturing Conference (EDTM)

Materials ScienceMaterials EngineeringElectrical EngineeringChip-scale PackageEngineering +13

Etch Rate Acceleration of SiO₂ during Wet Treatment after Gate Etching

Tetsuya Tatsumi, Seiichi Fukuda, S. Kadomura

Japanese Journal of Applied Physics

Materials ScienceGate EtchingElectrical EngineeringSio 2Engineering +11

Novel Channel-Stress Enhancement Technology with eSiGe S/D and Recessed Channel on Damascene Gate Process

J. Wang, Y. Tateshita, Shuji Yamakawa, +18

Materials EngineeringElectrical EngineeringEngineeringChannel StrainNanoelectronics +8

Impact of film structure on damage to low-<i>k</i>SiOCH film during plasma exposure

Shigeo Yasuhara, Juhyun Chung, Kunitoshi Tajima, +4

Journal of Physics D Applied Physics

Materials ScienceFilm StructurePlasma ElectronicsElectronic DevicesPlasma Exposure +13

High-Performance and Low-Power CMOS Device Technologies Featuring Metal/High-k Gate Stacks with Uniaxial Strained Silicon Channels on (100) and (110) Substrates

Y. Tateshita, J. Wang, K. Nagano, +26

Low-power ElectronicsElectrical EngineeringSemiconductor DeviceEngineeringVlsi Design +9

Structure-designable method to form super low-<i>k</i>SiOC film (<i>k</i>= 2.2) by neutral-beam-enhanced chemical vapour deposition

Shigeo Yasuhara, Juhyun Chung, Kunitoshi Tajima, +7

Journal of Physics D Applied Physics

Materials ScienceChemical EngineeringDielectric ConstantEngineeringSurface Science +13

Super-low-k SiOCH film (k = 1.9) with extremely high water resistance and thermal stability formed by neutral-beam-enhanced CVD

Shigeo Yasuhara, Toru Sasaki, Tsutomu Shimayama, +6

Journal of Physics D Applied Physics

Optical MaterialsEngineeringOptoelectronic DevicesThin Film Process TechnologyVacuum Device +16