T. Lin - Concepedia

Author

T. Lin

University of Maryland, College Park

Also Known As

T Lin, T. Lin, T.-C. Lin, Tzu-Ken Lin

Publications

401

Citations

H-Index

Concepts

All Affiliations

University of Maryland, College Park The University of Texas at Austin University of California, Berkeley Dayeh University National Chung Hsing University

About

T. Lin is an author at University of Maryland, College Park specializing in materials science, engineering, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	329
2	Applied Physics	7	7	224
3	Materials Engineering	3	3	67
4	Chemical Engineering	2	2	105
5	Chemistry	1	1	67

T. Lin

Publications

401

Citations

H-Index

Page 1

	Year	Citations
Relationship between nanoscale roughness and ion-damaged layer in argon plasma exposed polystyrene films Robert L. Bruce, F. Weilnboeck, T. Lin, Journal of Applied Physics EngineeringMechanical EngineeringNanoscale RoughnessPlasma ProcessingPolymer Processing	2010	101
Comparison of Erosion Behavior and Particle Contamination in Mass-Production CF4/O2 Plasma Chambers Using Y2O3 and YF3 Protective Coatings T. Lin, Wei‐Kai Wang, Shih-Yung Huang, Nanomaterials	2017	72
Study of ion and vacuum ultraviolet-induced effects on styrene- and ester-based polymers exposed to argon plasma Robert L. Bruce, Sebastian Engelmann, T. Lin, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Materials ScienceEster-based PolymersChemical EngineeringPlasma-polymer InteractionsVacuum Ultraviolet-induced Effects	2009	67
Preparation and Characterization of Sprayed-Yttrium Oxyfluoride Corrosion Protective Coating for Plasma Process Chambers T. Lin, Dong‐Sing Wuu, Shih-Yung Huang, Coatings Materials ScienceThermal Spray CoatingChemical EngineeringCorrosion ProtectionPlasma Process Chambers	2018	38
Characteristics of yttrium fluoride and yttrium oxide coatings for plasma process equipment prepared by atmospheric plasma spraying T. Lin, Dong‐Sing Wuu, Shih-Yung Huang, Japanese Journal of Applied Physics Materials ScienceMaterials EngineeringThermal Spray CoatingEngineeringPlasma Process Equipment	2016	33
Real-time studies of surface roughness development and reticulation mechanism of advanced photoresist materials during plasma processing Arup R. Pal, Robert L. Bruce, F. Weilnboeck, Journal of Applied Physics Optical MaterialsEngineeringElectron-beam LithographyMicroscopySurface Roughness Development	2009	23
On the absence of post-plasma etch surface and line edge roughness in vinylpyridine resists Robert L. Bruce, F. Weilnboeck, T. Lin, Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena Materials ScienceMaterials EngineeringSignificant RoughnessEngineeringSpecific Resistance	2011	22
Molecular structure effects on dry etching behavior of Si-containing resists in oxygen plasma Robert L. Bruce, T. Lin, R. J. Phaneuf, Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena EngineeringSio2 Layer ThicknessSilicon On InsulatorPlasma ProcessingPolymers	2010	18
Role of polymer structure and ceiling temperature in polymer roughening and degradation during plasma processing: a beam system study of P4MS and PαMS D. Nest, T-Y Chung, Joseph J. Végh, Journal of Physics D Applied Physics Optical MaterialsEngineeringResponsive PolymersCurrent Generation 193Plasma Processing	2010	15
Direct and quantitative evidence for buckling instability as a mechanism for roughening of polymer during plasma etching T. Lin, Robert L. Bruce, G. S. Oehrlein, Applied Physics Letters Quantitative EvidenceEngineeringMechanical EngineeringSoft MatterPlasma Processing	2012	12

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