D. Gui

Thermal stability of nitrogen incorporated in HfNxOy gate dielectrics prepared by reactive sputtering

Jinfeng Kang, H.Y. Yu, Chao Ren et al. · Applied Physics Letters · 2004 · 59 citations

Materials Science, Post Deposition Annealing, Electrical Engineering +13

Characterization and performance of dielectric diffusion barriers for Cu metallization

Zhe Chen, K. Prasad, C.Y. Li et al. · Thin Solid Films · 2004 · 30 citations

Materials Engineering, Materials Science, Electrical Engineering +10

Simultaneously enhanced energy storage performance and luminance resistance in (K _0.5Na _0.5)NbO ₃-based ceramics via synergistic optimization strategy

Yu Huan, D. Gui, Changxiao Li et al. · Journal of Advanced Ceramics · 2023 · 30 citations · Full text

Synergistic Optimization Strategy, Engineering, Functional Ceramic +16

Dielectric/metal sidewall diffusion barrier for Cu/porous ultralow-<i>k</i> interconnect technology

Zhe Chen, K. Prasad, C. Y. LI et al. · Applied Physics Letters · 2004 · 29 citations

Engineering, Thin Film Process Technology, Interconnect (Integrated Circuits) +17

Reduction of Oxygen Plasma Damage by Postdeposition Helium Plasma Treatment for Carbon-Doped Silicon Oxide Low Dielectric Constant Films

Y. H. Wang, D. Gui, Rakesh Kumar et al. · Electrochemical and Solid-State Letters · 2002 · 20 citations

Materials Science, Electrical Engineering, Chemical Engineering +15