C. Y. LI

Dielectric/metal sidewall diffusion barrier for Cu/porous ultralow-<i>k</i> interconnect technology

Zhe Chen, K. Prasad, C. Y. LI et al. · Applied Physics Letters · 2004 · 29 citations

Engineering, Thin Film Process Technology, Interconnect (Integrated Circuits) +17

Study of oxygen influences on carbon doped silicon oxide low <i>k</i> thin films deposited by plasma enhanced chemical vapor deposition

M. R. Wang, Rusli Rusli, Joseph Xie et al. · Journal of Applied Physics · 2004 · 20 citations

Materials Science, Oxygen Influences, Dielectric Constant +13

COMPARATIVE STUDY OF IONIZED METAL PLASMA <font>Ta, TaN</font> AND MULTISTACKED <font>Ta/TaN</font> STRUCTURE AS DIFFUSION BARRIERS FOR <font>Cu</font> METALLIZATION

C. Y. LI, Lei He, J. Wu et al. · Surface Review and Letters · 2001 · 20 citations

Engineering, Plasma Science, Plasma Physics +17

Impact of electroplated copper thickness on copper CMP and Cu/Coral™ BEOL integration

C. H. Seah, Ge‐Yun You, S.R. Wang et al. · Microelectronic Engineering · 2005 · 10 citations