Joseph Xie

Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature

W. H. Teh, L.T. Koh, S.M Chen et al. · Microelectronics Journal · 2001 · 62 citations

The mechanical properties of ultra-low-dielectric-constant films

Yu-Hsing Wang, M.R. Moitreyee, R. Kumar et al. · Thin Solid Films · 2004 · 28 citations

Materials Science, Engineering, Mechanical Properties +6

Study of oxygen influences on carbon doped silicon oxide low <i>k</i> thin films deposited by plasma enhanced chemical vapor deposition

M. R. Wang, Rusli Rusli, Joseph Xie et al. · Journal of Applied Physics · 2004 · 20 citations

Materials Science, Oxygen Influences, Dielectric Constant +13

COMPARATIVE STUDY OF IONIZED METAL PLASMA <font>Ta, TaN</font> AND MULTISTACKED <font>Ta/TaN</font> STRUCTURE AS DIFFUSION BARRIERS FOR <font>Cu</font> METALLIZATION

C. Y. LI, Lei He, J. Wu et al. · Surface Review and Letters · 2001 · 20 citations

Engineering, Plasma Science, Plasma Physics +17

Effect of ammonia plasma pretreatment on silicon–nitride barriers for Cu metallization systems

W. Qin, Z. Q. Mo, L.J. Tang et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2001 · 14 citations

Engineering, Silicon–nitride Barriers, Thin Film Process Technology +16