Concepedia

C. H. Seah

CH

5

Publications

115

Citations

5

H-Index

1999

Active since

Affiliations

Nanyang Technological University(Current)

C. H. Seah is an author at Nanyang Technological University specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceThin FilmsElectrochemistryMaterials EngineeringNanomaterialsMicrostructureApplied PhysicsElectronic PackagingElectrical Insulation

Publications per year

1999–2005

5

Publications

5

DC/pulse plating of copper for trench/via filling

C. H. Seah, S. Mridha, L.H Chan · Journal of Materials Processing Technology · 2001 · 40 citations

Electrical Engineering, Engineering, Construction Engineering +2

Annealing of copper electrodeposits

C. H. Seah, S. Mridha, Lisa Chan · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1999 · 29 citations

Materials Engineering, Materials Science, Electromigration Technique +14

Adhesive strength of electroplated copper films

C. H. Seah, S. Mridha, L. Chan · Journal of Materials Processing Technology · 2001 · 18 citations

Materials Science, Materials Engineering, Electromigration Technique +8

Fabrication of D.C.-plated nanocrystalline copper electrodeposits

C. H. Seah, S. Mridha, L. Chan · Journal of Materials Processing Technology · 1999 · 18 citations

Materials Science, Engineering, Nanomaterials +3

Impact of electroplated copper thickness on copper CMP and Cu/Coral™ BEOL integration

C. H. Seah, Ge‐Yun You, S.R. Wang et al. · Microelectronic Engineering · 2005 · 10 citations

Rows per page

1–5 of 5