Publication | Closed Access
Characterization and performance of dielectric diffusion barriers for Cu metallization
30
Citations
7
References
2004
Year
Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineeringDiffusion ResistanceApplied PhysicsMetallurgical InteractionMetallurgical ProcessElectronic PackagingDielectric Diffusion BarriersMicrostructureElectrical Insulation
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