Hsiang-Hung Chang

Statistics

Publications

Citations

242

H-Index

Active since

2009

Affiliations

Industrial Technology Research Institute(Current)

National Yang Ming Chiao Tung University

National Tsing Hua University

Hsiang-Hung Chang is an author at Industrial Technology Research Institute specializing in materials engineering, materials science, and semiconductor devices.

Publications per year

2009–2024

Publications

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee et al. · Materials · 2022 · 74 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrystalline Copper

Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +13

Process integration of 3D Si interposer with double-sided active chip attachments

Pei-Jer Tzeng, John H. Lau, Chau‐Jie Zhan et al. · 2013 · 25 citations

Engineering, Electrical Engineering, Microelectronics +16

Periodic reverse electrodeposition of (1 1 1)-oriented nanotwinned Cu in small damascene SiO2 vias

Shih‐Chi Yang, Dinh-Phuc Tran, Jia-Juen Ong et al. · Journal of Electroanalytical Chemistry · 2023 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +10

Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation

Rou-Jun Lee, Pin-Syuan He, Dinh-Phuc Tran et al. · Applied Surface Science · 2024 · 17 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

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