Statistics
Publications
3
Citations
222
H-Index
3
Active since
2009
J Y Hao is an author at Indium Corporation (United States) specializing in materials science, materials engineering, and engineering.
Publications per year
2009–2017
3
3
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
John H. Lau, Ming Li, Dewen Tian et al. · 2017 · 44 citations
Encapsulation challenges for wafer level packaging
Eric Kuah Th, J Y Hao, J P Ding et al. · 2009 · 23 citations
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