Statistics
Publications
2
Citations
36
H-Index
2
Active since
2009
Affiliations
J P Ding is an author at ASM International specializing in technological adoption, fan-out wafer-level packaging, and encapsulation.
Publications per year
2009–2009
2
2
Encapsulation challenges for wafer level packaging
Eric Kuah Th, J Y Hao, J P Ding et al. · 2009 · 23 citations
Encapsulation challenges for wafer level packaging
TH Eric Kuah, Jy Hao, J P Ding et al. · 2009 · 13 citations
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