Yu Po Wang

Statistics

Publications

Citations

132

H-Index

Active since

2006

Affiliations

Siliconware Precision Industries (Taiwan)(Current)

Yu Po Wang is an author at Siliconware Precision Industries (Taiwan) specializing in package reliability, materials engineering, and packaging engineering.

Publications per year

2006–2021

Publications

Silver alloy wire bonding

Liao Kai, Liang Yi Hung, L. Wu et al. · 2012 · 51 citations

Natural Sciences, Materials Engineering, Materials Science +16

Warpage and Stress Characteristic Analyses on Package-on-Package (PoP) Structure

Yuan Lin Tzeng, Nicholas Kao, Eason Chen et al. · 2007 · 23 citations

Engineering, Computer Engineering, Hardware-software Co-design +14

High Reliability Solution of 2.5D Package Technologies

Hsin Jou Lin, Vito Lin, Joe Lin et al. · 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) · 2021 · 21 citations

Engineering, Computer Engineering, High-performance Computing +17

Underfill Assessments and Validations for Low-k FCBGA

Nicholas Kao, Jeng Yuan Lai, Jase Jiang et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 2006 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +17

Halogen-Free Mold Compound Development for Ultra-Thin Packages

Fenny Liu, Chuqing Yao, Don Son Jiang et al. · 2007 · 10 citations

Agriculture, Materials Engineering, Materials Science +11

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