Concepedia

Xunqing Shi

XS

Statistics

Publications

8

Citations

271

H-Index

8

Active since

2001

Affiliations

Nanyang Technological University(Current)

Singapore Institute of Manufacturing Technology

Beijing University of Technology

Applied Science and Technology Research Institute

Xunqing Shi is an author at Nanyang Technological University specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

Publications per year

2001–2020

8

Publications

8

Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints

Guoyuan Li, Xunqing Shi · Transactions of Nonferrous Metals Society of China · 2006 · 56 citations

, , +4

Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints

P. Arulvanan, Z.W. Zhong, Xunqing Shi · Microelectronics Reliability · 2005 · 45 citations

, , +11

Thermal cycling aging effects on microstructural and mechanical properties of a single PBGA solder joint specimen

J.H.L. Pang, K H Tan, Xunqing Shi et al. · IEEE Transactions on Components and Packaging Technologies · 2001 · 44 citations

, , +15

Thermal Deformation Measurement by Digital Image Correlation Method

Yaofeng Sun, J.H.L. Pang, Xunqing Shi et al. · 2006 · 43 citations

, , +16

Protrusion of electroplated copper filled in through silicon vias during annealing process

Si Chen, Fei Qin, Tong An et al. · Microelectronics Reliability · 2016 · 33 citations

, , +12

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