Tong An

A predictive model of grinding force in silicon wafer self-rotating grinding

Jinglong Sun, Fei Qin, Pei Chen et al. · International Journal of Machine Tools and Manufacture · 2016 · 105 citations

Engineering, Manufacturing Engineering, Materials Science +8

Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process

Lixiang Zhang, Pei Chen, Tong An et al. · Current Applied Physics · 2019 · 84 citations

Engineering, Materials Engineering, Materials Science +14

Acoustic scene classification based on Mel spectrogram decomposition and model merging

Tao Zhang, Guoqing Feng, Jinhua Liang et al. · Applied Acoustics · 2021 · 72 citations

Natural Sciences, Physics, Acoustics +14

Modelling and experimental study of roughness in silicon wafer self-rotating grinding

Jinglong Sun, Pei Chen, Fei Qin et al. · Precision Engineering · 2017 · 50 citations

Engineering, Manufacturing Engineering, Materials Science +12

A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage

Fei Qin, Xiaorui Bie, Tong An et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2020 · 49 citations

Engineering, Electrical Engineering, Materials Science +17